Microscopic view of solder joint vibration with stress lines and crack propagation.

BGA vs. LGA: Which Solder Joint Type Offers Better Vibration Reliability?

Theo Raines in Tech & Innovation September 2025 • 4 min read.

"A Deep Dive into SAC105 and 63Sn37Pb Alloys"

In today's world, electronic devices are becoming smaller, thinner, and lighter. These advancements demand reliable components that can withstand various stresses, especially vibration. Ball Grid Array (BGA) and Land Grid Array (LGA) are two common types of solder joints used to connect components to circuit boards.

While both BGA and LGA serve the same basic purpose, they differ significantly in their design and, consequently, their performance under stress. Understanding these differences is crucial for engineers and designers aiming to create durable and reliable electronic products. The choice of solder alloy also plays a vital role, with SAC105 and 63Sn37Pb being two frequently used options.

Recent research dives deep into the vibration reliability of BGA and LGA solder joints, comparing the performance of SAC105 (lead-free) and 63Sn37Pb (tin-lead) alloys. By combining experimental testing with finite element simulations, the study sheds light on the strengths and weaknesses of each configuration, offering valuable insights for optimizing electronic device design.

BGA vs. LGA Solder Joints: Understanding Vibration Reliability

Microscopic view of solder joint vibration with stress lines and crack propagation.

The study compares the vibration reliability of LGA and BGA solders, alongside SAC105 and 63Sn37Pb solder alloys, under vibration loading conditions. Using resonance tracking vibration tests and finite element simulations, the research identifies key performance differences.

Reliability tests revealed that tin-lead solders outperformed lead-free solders in vibration resistance. The LGA solder joints showed better vibration reliability than BGA solders. This means that, under the conditions tested, devices using LGA connections with tin-lead solder were more likely to withstand vibration-induced failures.

Tin-Lead vs. Lead-Free: Tin-lead solders (63Sn37Pb) exhibit superior vibration reliability compared to lead-free alternatives (SAC105).
LGA vs. BGA: LGA solder joints generally offer better vibration reliability performance compared to BGA solder joints.
Failure Points: LGAs tend to fail at the printed circuit board (PCB) side, while BGAs typically fail at the component side.
Crack Propagation: In both LGA and BGA, cracks commonly propagate through the intermetallic compound layer.

Failure analysis pinpointed that in LGAs, cracks begin on the printed circuit board (PCB) side, whereas in BGAs, they start on the component side. Regardless of the solder type, cracks typically spread through the intermetallic compound layer. This detailed understanding of failure modes provides a basis for targeted improvements in solder joint design.

Implications for Design and Manufacturing

This research offers vital insights for designing more robust electronic devices, especially for applications in high-vibration environments. The findings support the use of tin-lead solders where regulations permit, and highlight the need for optimized designs in lead-free systems. Further investigation with larger sample sizes is recommended to refine these conclusions and better understand the long-term reliability of each solder joint type. By applying these insights, manufacturers can enhance product durability and minimize vibration-related failures.

About this Article -

This article was crafted using a human-AI hybrid and collaborative approach. AI assisted our team with initial drafting, research insights, identifying key questions, and image generation. Our human editors guided topic selection, defined the angle, structured the content, ensured factual accuracy and relevance, refined the tone, and conducted thorough editing to deliver helpful, high-quality information.See our About page for more information.

This article is based on research published under:

DOI-LINK: 10.1108/ssmt-07-2018-0020, Alternate LINK

Title: Experimental And Numerical Investigations Of The Vibration Reliability Of Bga And Lga Solder Configurations And Sac105 And 63Sn37Pb Solder Alloys

Subject: Electrical and Electronic Engineering

Journal: Soldering & Surface Mount Technology

Publisher: Emerald

Authors: Mohammad Gharaibeh, Aaron J. Stewart, Quang T. Su, James M. Pitarresi

Published: 2019-04-01

Everything You Need To Know

What are Ball Grid Array (BGA) and Land Grid Array (LGA) solder joints, and how do they differ?

Ball Grid Array (BGA) and Land Grid Array (LGA) are types of solder joints used to connect components to circuit boards. The primary difference lies in their design and how they handle stress, particularly vibration. BGAs use solder balls to create the connection, while LGAs have flat contact pads.

How did SAC105 and 63Sn37Pb solder alloys compare in vibration resistance?

In vibration tests comparing SAC105 and 63Sn37Pb solder alloys, 63Sn37Pb (tin-lead) solder demonstrated superior vibration resistance compared to SAC105 (lead-free) solder. This suggests that, under vibration loading conditions, devices using tin-lead solder are likely to exhibit higher reliability.

Which type of solder joint, LGA or BGA, provides better vibration reliability?

According to the vibration reliability study, LGA solder joints generally offer better vibration reliability compared to BGA solder joints. This means that, under the tested vibration conditions, devices using LGA connections are more likely to withstand vibration-induced failures.

Where do cracks typically initiate and propagate in LGA versus BGA solder joints?

Failure analysis indicates that in LGA solder joints, cracks typically initiate on the printed circuit board (PCB) side. Conversely, in BGA solder joints, cracks usually start on the component side. Regardless of whether it's an LGA or a BGA, crack propagation commonly occurs through the intermetallic compound layer.

What are the design and manufacturing implications of choosing between SAC105 and 63Sn37Pb solder alloys and LGA versus BGA solder joints, especially for devices in high-vibration environments?

The choice between SAC105 and 63Sn37Pb and LGA versus BGA has significant implications for the design and manufacturing of electronic devices, particularly those intended for high-vibration environments. Selecting tin-lead solders, where regulations permit, and optimizing designs for lead-free systems are crucial for enhancing product durability and minimizing vibration-related failures. Further research with larger sample sizes can help refine these conclusions and improve the long-term reliability of solder joint types.